Shenzhen Western Hemisphere Technology Co., Ltd.
Main products:Protective Film,Teflon Tape,Thermally Conductive Tape,VHB Tape,High Temperature Tape
Contact Us
  • Contact Person : Ms. Wang Sarah
  • Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
  • Tel : 86-755-61514569
  • Fax : 86-755-61514586
  • Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
  • Country/Region : China
  • Zip : 518104

UV dicing type

UV dicing type
Product Detailed
1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Detailed Product Description

- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water


*Wafer dicing, Wafer protection

*UV curing type

*Expandable type

*Precented dicing wafer from penetrating into interface

*Improved back side chipping

*Improved back side contamination by wafer

*Adhesive strength depends on chip size, chip thickness,etc


Tape Color:  Color

Tape Thickness: 130um

Base Film: Polyolefin/100um

Adhesive: 30um

Adhesion before UV: 3.00 N/10mm

Adhesion after UV: 0.22 N/10mm

 Note:  UV irradiation should be satisfied the following conditons in order to ensure the standard value

1) more than 100mW/cm2 of illuminance

2) more than 200mJ/cm2 of quantity of UV light

3) Wave length of ultraviolet should be around 365nm

UV dicing type

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