Shenzhen Western Hemisphere Technology Co., Ltd.
Main products:Protective Film,Teflon Tape,Thermally Conductive Tape,VHB Tape,High Temperature Tape
Products
Contact Us
  • Contact Person : Ms. Wang Sarah
  • Company Name : Shenzhen Western Hemisphere Technology Co., Ltd.
  • Tel : 86-755-61514569
  • Fax : 86-755-61514586
  • Address : Guangdong,Shenzhen,Building B, Licheng Technology Industrial Park, Shajing Gonghe,Bao'an District
  • Country/Region : China
  • Zip : 518104

Other Electronic Components
Best Thermally Conductive Adhesive Tape

Best Thermally Conductive Adhesive Tape

Carrier: Backing/Non-backing; Thickness: 0.10mm/0.15mm/0.20mm/0.30mm Thermal conductivity: 1.0W/M.K  Thermal Conductive Adhesive...
UV dicing type

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing, Wafer...
Best Elep holder back grinding type

Best Elep holder back grinding type

1.Type: Dicng Tape for BGA Board 2.Material: Polyolefin(PO) 3.Adhesion(Before UV) 9.00 N/20mm 4.Adhesion(After UV) 0.20 Detailed Product Description- Applicable to thick blade(under 200um) - Expandable type(PO film) - Srong holding and easy peel(UV Curable)  ...
Perfect Thermally Conductive transfer Tape

Perfect Thermally Conductive transfer Tape

product name:Thermally Conductive Tape colour:white backing/no backing Type Thickness: 0.10mm/0.15mm/0.20mm/0.30mm/0.4... Specification:Thermal conductive tape Good adhesion strength and superior thermal conductivity efficiency Good choice for thermal...
wafer tape

wafer tape

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm  Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing, Wafer...
UV dicing type

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
UV dicing type

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm  Description:1.Application:Wafer Protection  2.Type: Insulation Tape  3.Tensile Strength :30 N/10MM  4.Adhesion(Before UV) :3.00...
UV dicing type

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm Detailed Product Description- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
UV dicing type

UV dicing type

1.Application:Wafer Protection 2.Type: Insulation Tape 3.Tensile Strength :30 N/10MM 4.Adhesion(Before UV) :3.00 N/10mm  Product Description:- Dicing, protecting wafers - UV curing type - Improved back side chipping, contamination by water Feature:*Wafer dicing,...
PTFE glass cloth adhesive tape

PTFE glass cloth adhesive tape

1.Material: Fiberglass 2.Color: Brown/Black 3.Rated Voltage: 220V 4.Tensile Strength: 380 5.Type: Insulation Tape  Features : 1.Material: Fiberglass  2.Color: Brown and Black3.Rated Voltage: 220V 4.Tensile Strength: 3805.Type: Insulation Tape Insulation,...


Copyright Notice @ 2008-2012 ECVERY Limited and/or its subsidiaries and licensors. All rights reserved.